Tender for Thermal Paste Standard high performance thermal interface...

The DEVELOPMENT COMMISSIONER (MSME), a Public sector organization in India, has invited bids for Thermal Paste Standard high performance thermal interface paste for CPU motherboard chipset cooling, Qty: 10 Nos, (BOQ Item #6) in Kamrup, Assam, India.

As per the official tender notification (Tender ID: GEM/2026/B/7075576 | Ref ID: 133181477).

The tender is published on 06 Jan 2026, and the last date for bid submission is 27 Jan 2026.

All Eligible contractors, suppliers, and service providers from It Equipments, Storage System (V2) Pendrive (V2) High End Desktop Computer category are invited to participate in this opportunity, subject to meeting the prescribed eligibility criteria and tender conditions.

Notice Status: This Tender has Expired. While the deadline of 27 Jan 2026 has passed, this record remains available for historical reference, price benchmarking, and industry tracking purposes in Assam.

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Procurement Summary

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Country: India

State: Assam

Summary: Thermal Paste Standard high performance thermal interface paste for CPU motherboard chipset cooling, Qty: 10 Nos, (BOQ Item #6)

Posting Date: 06 Jan 2026

Deadline: 27 Jan 2026

Purchaser's Detail

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Other Information

Notice Type: Tender

RefID: 133181477

Notice Ref. No.: GEM/2026/B/7075576

Tender Value: Refer Document

Tender EMD: Refer Document

Tender Document Cost: Refer Document

Competition: NCB

Financier: Self Financed

Purchaser Ownership: Public

Tender's Details

BOQ Item Description: AS PER ANNEXURE I
BOQ Title: It Equipments, Storage System (V2) Pendrive (V2) High End Desktop Computer
Item Title: Thermal Paste Standard high performance thermal interface paste for CPU motherboard chipset cooling
Item Quantity: 10
Unit of Measure: Nos
Delivery Period (In number of days): 15
Start Date: 06-01-2026 10:37 AM
End Date: 27-01-2026 11:00 AM
BOQ Title: IT EQUIPMENTS
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Notice Documents

Tender Notice

Bid_Document_8799432.pdf

Specification_Document.pdf

BOQ_Document.csv