Tender for Node Mcu, Microcontroller IOT & coding, Ideal for learnin...

The SOFTWARE TECHNOLOGY PARKS OF INDIA (STPI), a Public sector organization in India, has invited bids for Node Mcu, Microcontroller IOT & coding, Ideal for learning WiFi-based IoT projects and automation., Qty: 25 Pieces, (BOQ Item #5) in Kamrup, Assam, India.

As per the official tender notification (Tender ID: GEM/2025/B/6773056 | Ref ID: 127938340).

The tender is published on 11 Oct 2025, and the last date for bid submission is 31 Oct 2025.

All Eligible contractors, suppliers, and service providers from Consumable and Capital Items at Stpi Guwahati, Inductive Proximity Sensor category are invited to participate in this opportunity, subject to meeting the prescribed eligibility criteria and tender conditions.

Notice Status: This Tender has Expired. While the deadline of 31 Oct 2025 has passed, this record remains available for historical reference, price benchmarking, and industry tracking purposes in Assam.

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Procurement Summary

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Country: India

State: Assam

Summary: Node Mcu, Microcontroller IOT & coding, Ideal for learning WiFi-based IoT projects and automation., Qty: 25 Pieces, (BOQ Item #5)

Posting Date: 11 Oct 2025

Deadline: 31 Oct 2025

Purchaser's Detail

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Other Information

Notice Type: Tender

RefID: 127938340

Notice Ref. No.: GEM/2025/B/6773056

Tender Value: Refer Document

Tender EMD: Refer Document

Tender Document Cost: Refer Document

Competition: NCB

Financier: Self Financed

Purchaser Ownership: Public

Tender's Details

BOQ Item Description: Microcontroller IOT & coding, Ideal for learning WiFi-based IoT projects and automation.
BOQ Title: Consumable and Capital Items at Stpi Guwahati, Inductive Proximity Sensor
Item Title: Node Mcu
Item Quantity: 25
Unit of Measure: Pieces
Delivery Period (In number of days): 30
Start Date: 10-10-2025 4:04 PM
End Date: 31-10-2025 5:00 PM
BOQ Title: CONSUMABLE AND CAPITAL ITEMS AT STPI GUWAHATI
GeMARPTS Searched: Microcontroller Based Melting and Boiling Point Apparatus, TERA Package 1 - Robotics and Electro - Mechanical Components (ASoSE), TERA Package 1 - Robotics and Automation Modular Skilling Kits, TERA Package 1 - Robotics and Automation High end Engineering (ASoSE), TERA Package 2 - Robotics and Autom...

Notice Documents

Tender Notice

Bid_Document_8453583.pdf

Specification_Document.pdf

BOQ_Document.csv